Lau, John H. <br/><br/>
Microvias  : for low cost, high density interconnects 
John H. Lau and S.W. Ricky Lee 
 - New York:  Mc Graw -Hill,  2001. 
 -  xxiii,565p. 
<br/><br/> HB 
<br/><br/><br/>Eng 
<br/><br/><label>ISBN: </label>0071363270 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Chips
<br/><br/><label>Dewey Class. No.: </label>621.381  / LAM