| 000 | 00452nam a2200169Ia 4500 | ||
|---|---|---|---|
| 020 | _a0071363270 | ||
| 082 |
_a621.381 _bLAM |
||
| 100 |
_aLau, John H. _979763 |
||
| 245 |
_aMicrovias _b: for low cost, high density interconnects _cJohn H. Lau and S.W. Ricky Lee |
||
| 260 |
_aNew York: _bMc Graw -Hill, _c2001. |
||
| 300 | _bxxiii,565p. | ||
| 500 | _aHB | ||
| 546 | _aEng | ||
| 650 |
_aChips _979764 |
||
| 700 |
_aLee, S.W. Ricky _979765 |
||
| 942 | _cBK | ||
| 999 |
_c31754 _d31754 |
||