000			02041 a2200277 4500
020			_a0387324666
020			_a9780387324661
082	0	4	_a621.38104 _bLEA
245	0	0	_aLead-free soldering. _cEdited by Jasbir Bath
260			_aNew York: _bSpringer, _c2007.
300			_axiv, 299p.
500			_aHB
520			_aThe push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia. Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.
546			_aEng
650		4	_aApplied optics _917048
650		4	_aTechnology & Engineering _983496
650		4	_aTechnology & Industrial Arts _996
650		4	_aElectricity _983497
650		4	_aEngineering - Electrical & Electronic _9458
650		4	_aMetallurgy _983498
650		4	_aTechnology & Engineering - Electrical _983499
650		4	_aTechnology & Engineering - Electronics Microelectronics _973482
650		4	_aMechanical Engineering _983500
700	1		_aBath, Jasbir (ed.) _983501
942			_cBK
999			_c34090 _d34090