Microvias : for low cost, high density interconnects John H. Lau and S.W. Ricky Lee
Material type:
TextPublication details: New York: Mc Graw -Hill, 2001.Description: xxiii,565pISBN: - 0071363270
- 621.381 LAM
| Item type | Current library | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|
| Books | Central Library Allama Iqbal Open University Islamabad General Stacks | 621.381 LAM (Browse shelf(Opens below)) | Available | 102132 |
HB
Eng
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