Advanced electronic packaging Edited by Richard K. Ulrich

Contributor(s):

Publication details: Canada: Wiley-IEEE Press, 2006.Edition: 2nd edDescription: xxvi, 812 pISBN:

0471466093
9780471466093

Subject(s):

Microelectronic packaging

DDC classification:

621.381046 ADV

Summary: As in the First Edition , each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition , which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books	Central Library Allama Iqbal Open University Islamabad General Stacks	621.381046 ADV (Browse shelf(Opens below))	Available		110149

As in the First Edition , each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition , which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

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