Advanced electronic packaging
by
Ulrich, Richard K. (ed.)
; Brown, William D. (ed.)
.
Publisher: Canada: Wiley-IEEE Press, 2006Edition: 2nd ed.Description: xxvi, 812 p.ISBN: 0471466093; 9780471466093.Subject(s): Microelectronic packaging![](/opac-tmpl/prog/images/filefind.png)
Item type | Location | Call number | Status | Date due | Barcode | Item holds |
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Books |
Central Library AIOU Islamabad
General Stacks
Allama Iqbal Open UniversityCentral Library |
621.381046 ADV (Browse shelf) | Available | 110149 |
Total holds: 0
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621.381045 AGL Lightwave technology | 621.381045 GAO Optoelectronic devices and circuits | 621.381045 RII Introduction to high-speed electronics and optoelectronics | 621.381046 ADV Advanced electronic packaging | 621.381046 ARE Area array packaging materials | 621.38107 GUE Electronics made simple | 621.38107 OPD Digital signal processing |
HB
As in the First Edition , each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition , which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Eng
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