Lau, John H.
Microvias : for low cost, high density interconnects John H. Lau and S.W. Ricky Lee - New York: Mc Graw -Hill, 2001. - xxiii,565p.
HB
Eng
0071363270
Chips
621.381 / LAM
Microvias : for low cost, high density interconnects John H. Lau and S.W. Ricky Lee - New York: Mc Graw -Hill, 2001. - xxiii,565p.
HB
Eng
0071363270
Chips
621.381 / LAM