Lau, John H.

Microvias : for low cost, high density interconnects John H. Lau and S.W. Ricky Lee - New York: Mc Graw -Hill, 2001. - xxiii,565p.

HB


Eng

0071363270


Chips

621.381 / LAM

Copyright © 2023, All rights reserved
AIOU, Islamabad Pakistan.
Ph#: | 051-9250040, 051-9571682, 051-9571695 Fax: | 051-9250146 Email| documentdelivery@aiou.edu.pk Web| ”Central Library”