Microvias : for low cost, high density interconnects
by
Lau, John H
; Lee, S.W. Ricky
.
Material type: ![materialTypeLabel](/opac-tmpl/lib/famfamfam/BK.png)
![](/opac-tmpl/prog/images/filefind.png)
Item type | Location | Call number | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|
Books |
Central Library AIOU Islamabad
General Stacks
Allama Iqbal Open UniversityCentral Library |
621.381 LAM (Browse shelf) | Available | 102132 |
Total holds: 0
HB
Eng
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