| 000 -LEADER |
|---|
| fixed length control field |
00452nam a2200169Ia 4500 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| ISBN |
0071363270 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.381 |
| Item number |
LAM |
| 100 ## - MAIN ENTRY--AUTHOR NAME |
|---|
| Personal name |
Lau, John H. |
| 245 ## - TITLE STATEMENT |
|---|
| Title |
Microvias |
| Sub Title |
: for low cost, high density interconnects |
| Statement of responsibility, etc |
John H. Lau and S.W. Ricky Lee |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) |
|---|
| Place of publication |
New York: |
| Name of publisher |
Mc Graw -Hill, |
| Year of publication |
2001. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Other physical details |
xxiii,565p. |
| 500 ## - GENERAL NOTE |
|---|
| General note |
HB |
| 546 ## - LANGUAGE NOTE |
|---|
| Language note |
Eng |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical Term |
Chips |
| 700 ## - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Lee, S.W. Ricky |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Koha item type |
Books |