Microvias : for low cost, high density interconnects
by Lau, John H; Lee, S.W. Ricky.
Material type: BookPublisher: New York: Mc Graw -Hill, 2001Description: xxiii,565p.ISBN: 0071363270.Subject(s): ChipsItem type | Location | Call number | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|
Books |
Central Library AIOU Islamabad
General Stacks
Allama Iqbal Open UniversityCentral Library |
621.381 LAM (Browse shelf) | Available | 102132 |
Total holds: 0
HB
Eng
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