Microvias : for low cost, high density interconnects
by
Lau, John H
; Lee, S.W. Ricky
.
Material type: ![materialTypeLabel](/opac-tmpl/lib/famfamfam/BK.png)
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Item type | Location | Call number | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|
Books |
Central Library AIOU Islamabad
General Stacks
Allama Iqbal Open UniversityCentral Library |
621.381 LAM (Browse shelf) | Available | 102132 |
Total holds: 0
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No cover image available | No cover image available | ||
621.381 KRD Documentary | 621.381 KRE Electronic concepts | 621.381 LAM Modern digital and analog communication systems | 621.381 LAM Microvias | 621.381 LEA Lead-Free electronic solders | 621.381 LYM Electron-Tube Circuits | 621.381 LYN Nano-and microelectromechanical systems |
HB
Eng
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